NSYMR64

Specifications

Yükseklik

600

Seri

pushPIN™

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method

Push Pin

For Use With

Spacial CRN Enclosure, Spacial S3D Enclosure, Spacial S3X Enclosure, Spacial S57 Enclosure, ThalassaThalassa PLM enclosure

Height Off Base Height Of Fin

0.984 (25.00mm)

Ürün Durumu

Active

Dimensions

555 x 351 x 2mm

Paket

Bulk

Thermal Resistance Forced Air Flow

8.69°C/W @ 100 LFM

Material Finish

Blue Anodized

Tip

Top Mount

Surface Protection

Galvanized

For Use Withrelated Products

Enclosures

Material

Aluminum

Genişlik

1.772 (45.00mm)

Accessory Type

Plate

Shape

Square, Fins

Parça Durumu

Active

Uzunluk

1.772 (45.00mm)