SDSDQM-032G-B35A

Specifications

Package Style

UNCASED CHIP

REACH Uyumluluk Kodu

unknown

Jesd30 Code

X-XUUC-N

Package Description

DIE,

Tepe Reflow Süresi (maks. sn)

NOT SPECIFIED

Package Shape

UNSPECIFIED

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT

Additional Feature

AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA

Ihs Manufacturer

SANDISK CORP

Yüzey Montaj

YES

Part Life Cycle Code

Transferred

HTS Kodu

8542.31.00.01

Package Body Material

UNSPECIFIED

Package Code

DIE

Terminal Formu

NO LEAD

Tepe Reflow Sıcaklığı (°C)

NOT SPECIFIED

Terminal Pozisyonu

UPPER

Rohs Code

Yes