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Priced by quantity and lead time.
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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- HTS Kodu
- 8542.39.00.01
- Seated Heightmax
- 5.08 mm
- Package Code
- DIP
- Part Package Code
- DIP
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- Terminal Adımı
- 2.54 mm
- Jesd30 Code
- R-PDIP-T8
- Fonksiyon Sayısı
- 1
- Package Description
- DIP,
- Qualification Status
- Not Qualified
- Uzunluk
- 9.2 mm
- Terminal Pozisyonu
- DUAL
- Package Style
- IN-LINE
- Terminal Formu
- THROUGH-HOLE
- Operating Temperaturemin
- -20 °C
- REACH Uyumluluk Kodu
- unknown
- Operating Temperaturemax
- 70 °C
- Pin Sayısı
- 8
- Temperature Grade
- COMMERCIAL
- Number Of Terminals
- 8
- Genişlik
- 7.62 mm
- Package Shape
- RECTANGULAR
- Telecom Ic Type
- TELEPHONE RINGER CIRCUIT
- Part Life Cycle Code
- Obsolete
- Package Body Material
- PLASTIC/EPOXY
- Yüzey Montaj
- NO
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