M395T2863QZ4-CE66

Specifications

Number Of Chip Per Module

9

Minimum Operating Temperature C

0

Module Type

240FBDIMM

Maximum Clock Rate Mhz

667

Pll

Yes

Supplier Package

FBDIMM

Chip Package Type

FBGA

Chip Configuration

128Mx8

Minimum Operating Supply Voltage V

1.7

Maximum Operating Supply Voltage V

1.9

Automotive

No

Number Of Chip Banks

8

Eccn Us

EAR99

Chip Density Bit

1G

Pc Type

PC2-5300

Package Height

30.35

Package Length

133.35

Parça Durumu

Obsolete

Package Width

8.2(Max)

Ecc Support

Yes

Maximum Operating Temperature C

85

Module

DRAM Module

Cas Latency

5

Module Density

1Gbyte

Eu Rohs

Compliant

Number Of Ranks

Single

Lead Shape

No Lead

Mounting

Socket

Pin Sayısı

240

Ppap

No

Typical Operating Supply Voltage V

1.8

Spd Eeprom Support

Yes

Module Sides

Double

Pcb Changed

240

Data Bus Width Bit

72

Organization

128Mx72

Self Refresh

Yes