KMDP6001DA-B425

Specifications

REACH Uyumluluk Kodu

compliant

Part Life Cycle Code

Obsolete

Gross Weight

0.77 g

Mixed Memory Type

FLASH+DRAM

Contact Plating

gold-plated

Organization

64GX8

Profile

beryllium copper

Fonksiyon Sayısı

1

Akım Değeri

1.5A

Spatial Orientation

straight

Jesd30 Code

R-PBGA-B254

Connector

socket

Connector Pinout Layout

1x9

Type Of Connector

pin strips

Number Of Words

68719476736 words

Plating Thickness

0.75µm

Çalışma Sıcaklığı

-40...163°C

Electrical Mounting

THT

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Shape

RECTANGULAR

Number Of Words Code

64000000000

Package Body Material

PLASTIC/EPOXY

Number Of Terminals

254

Memory Density

549755813888 bit

Contacts Pitch

2.54mm

Pin Sayısı

9

Rated Voltage

60V

Kind Of Connector

female

Memory Width

8

Additional Feature

DRAM IS ORGANISED AS 32G X 1

Yüzey Montaj

YES

Flammability Rating

UL94V-0

Terminal Pozisyonu

BOTTOM

Memory Ic Type

MEMORY CIRCUIT

Package Description

FBGA-254

Terminal Formu

BALL