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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Operating Temperaturemin
- -40 °C
- Memory Density
- 536870912 bit
- Qualification Status
- Not Qualified
- Package Code
- FBGA
- Yüzey Montaj
- YES
- Supply Currentmax
- 0.04 mA
- Command User Interface
- YES
- Number Of Words
- 33554432 words
- Access Timemax
- 11.5 ns
- Package Body Material
- PLASTIC/EPOXY
- Moisture Sensitivity Levels
- 1
- Number Of Sectorssize
- 512
- Standby Currentmax
- 0.00008 A
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- Operating Temperaturemax
- 85 °C
- Rohs Code
- Yes
- Number Of Words Code
- 32000000
- Number Of Terminals
- 63
- Kurşunsuz Kodu
- Yes
- Page Size
- 1K words
- JESD-609 Kodu
- e3
- Data Polling
- NO
- ECCN Kodu
- EAR99
- Jesd30 Code
- R-PBGA-B63
- Sector Size
- 64K
- Terminal Adımı
- 0.8 mm
- Toggle Bit
- NO
- Package Style
- GRID ARRAY, FINE PITCH
- Terminal Formu
- BALL
- Temperature Grade
- INDUSTRIAL
- Part Life Cycle Code
- Obsolete
- Organization
- 32MX16
- Supply Voltagenom Vsup
- 3.3 V
- Package Equivalence Code
- BGA63,10X12,32
- Memory Width
- 16
- HTS Kodu
- 8542.32.00.51
- Terminal Pozisyonu
- BOTTOM
- Terminal Kaplaması
- MATTE TIN
- Memory Ic Type
- FLASH
- Package Shape
- RECTANGULAR
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