Request a quote for pricing
Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Part Life Cycle Code
- Obsolete
- Access Timemax
- 40 ns
- Parallelserial
- PARALLEL
- Number Of Terminals
- 63
- Supply Currentmax
- 0.015 mA
- Memory Ic Type
- FLASH
- Jesd30 Code
- R-PBGA-B63
- Memory Density
- 268435456 bit
- Data Polling
- NO
- Number Of Words
- 16777216 words
- Standby Currentmax
- 0.00005 A
- Readybusy
- YES
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA63,10X12,32
- Terminal Pozisyonu
- BOTTOM
- Toggle Bit
- NO
- Page Size
- 256 words
- Sector Size
- 8K
- Package Body Material
- PLASTIC/EPOXY
- Operating Temperaturemax
- 70 °C
- Temperature Grade
- COMMERCIAL
- Supply Voltagenom Vsup
- 1.8 V
- Qualification Status
- Not Qualified
- Rohs Code
- Yes
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- REACH Uyumluluk Kodu
- compliant
- Package Style
- GRID ARRAY, FINE PITCH
- Organization
- 16MX16
- Command User Interface
- YES
- Memory Width
- 16
- ECCN Kodu
- EAR99
- Package Description
- FBGA, BGA63,10X12,32
- Package Shape
- RECTANGULAR
- HTS Kodu
- 8542.32.00.51
- Terminal Adımı
- 0.8 mm
- Package Code
- FBGA
- Terminal Formu
- BALL
- Number Of Words Code
- 16000000
- Number Of Sectorssize
- 2K
Related Products
HARTING
09806150100
Memory Modules
Advantech
14S6100010
Memory Modules
TE Connectivity
2-965363-1
Memory Modules
TE Connectivity
2-968358-1
Memory Modules
Microchip Technology
2284700-R
Memory Modules
Microchip Technology
25CS640-H/SN
Memory Modules
Microchip Technology
25CS640T-E/Q4B
Memory Modules
Microchip Technology
25CS640T-H/SN
Memory Modules