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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Supply Voltagemin Vsup
- 1.65 V
- Package Style
- GRID ARRAY, VERY THIN PROFILE, FINE PITCH
- REACH Uyumluluk Kodu
- compliant
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- Uzunluk
- 11 mm
- Qualification Status
- Not Qualified
- Supply Voltagenom Vsup
- 1.8 V
- Temperature Grade
- COMMERCIAL
- Genişlik
- 9 mm
- Package Body Material
- PLASTIC/EPOXY
- Operating Temperaturemax
- 70 °C
- Sector Size
- 8K
- Pin Sayısı
- 63
- Programming Voltage
- 1.8 V
- Number Of Sectorssize
- 2K
- Seated Heightmax
- 1 mm
- Number Of Words Code
- 16000000
- Supply Voltagemax Vsup
- 1.95 V
- Terminal Formu
- BALL
- Package Code
- VFBGA
- Terminal Adımı
- 0.8 mm
- HTS Kodu
- 8542.32.00.51
- Package Description
- VFBGA, BGA63,10X12,32
- Package Shape
- RECTANGULAR
- ECCN Kodu
- EAR99
- Memory Width
- 16
- Command User Interface
- YES
- Organization
- 16MX16
- Part Package Code
- BGA
- Fonksiyon Sayısı
- 1
- Memory Ic Type
- FLASH
- Jesd30 Code
- R-PBGA-B63
- Supply Currentmax
- 0.015 mA
- Number Of Terminals
- 63
- Access Timemax
- 30 ns
- Parallelserial
- PARALLEL
- Part Life Cycle Code
- Obsolete
- Page Size
- 256 words
- Toggle Bit
- NO
- Terminal Pozisyonu
- BOTTOM
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