+90 533 300 32 01
C3 ChipZentronix

Samsung Semiconductor

K9F5616D0C-YCB0

Memory Modules

RoHS: Compliant

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RoHS

Compliant

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Specifications

Terminal Kaplaması
TIN LEAD
Terminal Adımı
0.5 mm
Number Of Words Code
16000000
Number Of Sectorssize
2K
Package Code
TSSOP
Terminal Formu
GULL WING
Memory Width
16
Organization
16MX16
Command User Interface
YES
HTS Kodu
8542.32.00.51
ECCN Kodu
EAR99
Package Description
TSSOP, TSSOP48,.8,20
Package Shape
RECTANGULAR
Rohs Code
No
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
REACH Uyumluluk Kodu
compliant
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Sector Size
8K
JESD-609 Kodu
e0
Package Body Material
PLASTIC/EPOXY
Operating Temperaturemax
70 °C
Temperature Grade
COMMERCIAL
Qualification Status
Not Qualified
Supply Voltagenom Vsup
2.65 V
Kurşunsuz Kodu
No
Standby Currentmax
0.00005 A
Readybusy
YES
Yüzey Montaj
YES
Package Equivalence Code
TSSOP48,.8,20
Number Of Words
16777216 words
Page Size
256 words
Terminal Pozisyonu
DUAL
Toggle Bit
NO
Memory Density
268435456 bit
Data Polling
NO
Access Timemax
30 ns
Parallelserial
PARALLEL
Number Of Terminals
48
Part Life Cycle Code
Obsolete
Supply Currentmax
0.02 mA

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