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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Terminal Adımı
- 0.8 mm
- Number Of Sectorssize
- 1K
- Number Of Words Code
- 8000000
- Terminal Formu
- BALL
- Package Code
- FBGA
- Memory Width
- 16
- Command User Interface
- YES
- Organization
- 8MX16
- HTS Kodu
- 8542.32.00.51
- Package Shape
- RECTANGULAR
- Package Description
- FBGA, BGA63,10X12,32
- ECCN Kodu
- EAR99
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- REACH Uyumluluk Kodu
- compliant
- Package Style
- GRID ARRAY, FINE PITCH
- Operating Temperaturemax
- 70 °C
- Package Body Material
- PLASTIC/EPOXY
- Sector Size
- 8K
- Qualification Status
- Not Qualified
- Supply Voltagenom Vsup
- 3.3 V
- Temperature Grade
- COMMERCIAL
- Readybusy
- YES
- Yüzey Montaj
- YES
- Package Equivalence Code
- BGA63,10X12,32
- Standby Currentmax
- 0.00005 A
- Number Of Words
- 8388608 words
- Page Size
- 256 words
- Toggle Bit
- NO
- Terminal Pozisyonu
- BOTTOM
- Memory Density
- 134217728 bit
- Data Polling
- NO
- Number Of Terminals
- 63
- Access Timemax
- 30 ns
- Parallelserial
- PARALLEL
- Part Life Cycle Code
- Obsolete
- Jesd30 Code
- R-PBGA-B63
- Tip
- SLC NAND TYPE
- Memory Ic Type
- FLASH
- Supply Currentmax
- 0.02 mA
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