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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Memory Width
- 16
- Supply Voltagemax Vsup
- 3.6 V
- Number Of Words Code
- 8000000
- Package Code
- VFBGA
- Package Body Material
- PLASTIC/EPOXY
- Pin Sayısı
- 63
- Supply Voltagenom Vsup
- 3.3 V
- Temperature Grade
- COMMERCIAL
- Ihs Manufacturer
- SAMSUNG SEMICONDUCTOR INC
- Uzunluk
- 11 mm
- Package Style
- GRID ARRAY, VERY THIN PROFILE, FINE PITCH
- REACH Uyumluluk Kodu
- compliant
- Data Polling
- NO
- Standby Currentmax
- 0.00005 A
- Operating Mode
- ASYNCHRONOUS
- Number Of Words
- 8388608 words
- Toggle Bit
- NO
- Terminal Pozisyonu
- BOTTOM
- Number Of Terminals
- 63
- Parallelserial
- SERIAL
- Access Timemax
- 30 ns
- Jesd30 Code
- R-PBGA-B63
- Memory Ic Type
- FLASH
- Tip
- SLC NAND TYPE
- Additional Feature
- CONTAINS ADDITIONAL 4M BIT NAND FLASH
- Organization
- 8MX16
- Command User Interface
- YES
- HTS Kodu
- 8542.32.00.51
- Package Shape
- RECTANGULAR
- Package Description
- 9 X 11 MM, 0.80 MM PITCH, TBGA-63
- ECCN Kodu
- EAR99
- Terminal Adımı
- 0.8 mm
- Seated Heightmax
- 1 mm
- Number Of Sectorssize
- 1K
- Terminal Formu
- BALL
- Operating Temperaturemax
- 70 °C
- Programming Voltage
- 2.7 V
- Sector Size
- 8K
- Qualification Status
- Not Qualified
- Genişlik
- 9 mm
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