K9F1216U0A-DIB0

Specifications

Memory Density

536870912 bit

Terminal Pozisyonu

BOTTOM

Yüzey Montaj

YES

Operating Mode

ASYNCHRONOUS

Number Of Words

33554432 words

Jesd30 Code

R-PBGA-B63

Memory Ic Type

FLASH

Operating Temperaturemin

-40 °C

Number Of Terminals

63

Access Timemax

30 ns

Parallelserial

PARALLEL

Part Life Cycle Code

Obsolete

Part Package Code

BGA

Fonksiyon Sayısı

1

HTS Kodu

8542.32.00.51

Package Description

VFBGA,

Package Shape

RECTANGULAR

ECCN Kodu

EAR99

Memory Width

16

Additional Feature

CONTAINS ADDITIONAL 16M BIT NAND FLASH

Organization

32MX16

Seated Heightmax

1 mm

Number Of Words Code

32000000

Supply Voltagemax Vsup

3.6 V

Terminal Formu

BALL

Package Code

VFBGA

Terminal Adımı

0.8 mm

Qualification Status

Not Qualified

Supply Voltagenom Vsup

3.3 V

Temperature Grade

INDUSTRIAL

Genişlik

9 mm

Operating Temperaturemax

85 °C

Package Body Material

PLASTIC/EPOXY

Programming Voltage

2.7 V

Pin Sayısı

63

Supply Voltagemin Vsup

2.7 V

REACH Uyumluluk Kodu

unknown

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Uzunluk

11 mm