K9F1216Q0A-DCB0

Specifications

ECCN Kodu

EAR99

Package Shape

RECTANGULAR

Package Description

VFBGA,

HTS Kodu

8542.32.00.51

Organization

32MX16

Additional Feature

CONTAINS ADDITIONAL 16M BIT NAND FLASH

Memory Width

16

Package Code

VFBGA

Terminal Formu

BALL

Supply Voltagemax Vsup

1.95 V

Number Of Words Code

32000000

Seated Heightmax

1 mm

Terminal Adımı

0.8 mm

Genişlik

9 mm

Temperature Grade

COMMERCIAL

Supply Voltagenom Vsup

1.8 V

Qualification Status

Not Qualified

Programming Voltage

1.8 V

Pin Sayısı

63

Package Body Material

PLASTIC/EPOXY

Operating Temperaturemax

70 °C

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

REACH Uyumluluk Kodu

unknown

Supply Voltagemin Vsup

1.65 V

Uzunluk

11 mm

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Memory Density

536870912 bit

Terminal Pozisyonu

BOTTOM

Number Of Words

33554432 words

Operating Mode

ASYNCHRONOUS

Yüzey Montaj

YES

Memory Ic Type

FLASH

Jesd30 Code

R-PBGA-B63

Part Life Cycle Code

Obsolete

Parallelserial

PARALLEL

Access Timemax

30 ns

Number Of Terminals

63

Fonksiyon Sayısı

1

Part Package Code

BGA