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C3 ChipZentronix
M474A1G43DB1-CRC000

Samsung Electronics

M474A1G43DB1-CRC000

Memory Cards

RoHS: Compliant

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Specifications

Typical Operating Supply Voltage V
1.2
Organization
1Gx72
Cas Latency
17
Maximum Operating Supply Voltage V
1.26
Supplier Package
USODIMM
Chip Package Type
78FBGA
Module
DRAM Module
Mounting
Socket
Pin Sayısı
260
Operating Current Ma
1100
Number Of Chip Per Module
18
Package Height
30
Eccn Us
EAR99
Hts
8542.32.00.71
Chip Configuration
512Mx8
Package Width
3.7(Max)
Module Type
260USODIMM
Maximum Clock Rate Mhz
2400
Package Length
69.6
Minimum Operating Supply Voltage V
1.14
Number Of Ranks
Dual
Data Bus Width Bit
72
Pcb Changed
260
Module Density
8Gbyte
Chip Density Bit
4G
Parça Durumu
Obsolete
Ecc Support
Yes

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