M471B5173DB0-YK000

Specifications

Eccn Us

4A994.a

Minimum Operating Temperature C

0

Hts

8473.30.11.40

Chip Configuration

512Mx8

Mounting

Socket

Pin Sayısı

204

Number Of Chip Per Module

8

Module Sides

Double

Package Height

30

Cas Latency

11

Supplier Package

USODIMM

Chip Package Type

FBGA

Module

DRAM Module

Typical Operating Supply Voltage V

1.35

Organization

512Mx64

Chip Density Bit

4G

Parça Durumu

Obsolete

RoHS Durumu

RoHS Compliant

Ecc Support

No

Maximum Operating Temperature C

85

Data Bus Width Bit

64

Number Of Ranks

Single

Pcb Changed

204

Supplier Temperature Grade

Commercial

Module Density

4Gbyte

Lead Shape

No Lead

Module Type

204USODIMM

Package Length

67.6

Maximum Clock Rate Mhz

1600

Package Width

3.8(Max)

Standard Package Name

DIM