M471B5173DB0-YK0

Specifications

Cas Latency

11

Chip Package Type

FBGA

Supplier Package

USODIMM

Module

DRAM Module

Typical Operating Supply Voltage V

1.35

Organization

512Mx64

Minimum Operating Temperature C

0

Eccn Us

4A994.a

Chip Configuration

512Mx8

Pin Sayısı

204

Mounting

Socket

Number Of Chip Per Module

8

Module Sides

Double

Package Height

30

Maximum Clock Rate Mhz

1600

Package Length

67.6

Module Type

204USODIMM

Package Width

3.8(Max)

Standard Package Name

DIM

Chip Density Bit

4G

Parça Durumu

Obsolete

Maximum Operating Temperature C

85

Ecc Support

No

RoHS Durumu

RoHS Compliant

Pcb Changed

204

Data Bus Width Bit

64

Number Of Ranks

Single

Lead Shape

No Lead

Supplier Temperature Grade

Commercial

Module Density

4Gbyte