M471A5244CB0-CRC

Specifications

Organization

512Mx64

Typical Operating Supply Voltage V

1.2

Module

DRAM Module

Chip Package Type

FBGA

Supplier Package

SODIMM

Cas Latency

17

Package Height

30

Number Of Chip Per Module

8

Mounting

Socket

Pin Sayısı

260

Chip Configuration

512Mx16

Hts

8473.30.11.40

Eccn Us

4A994.a

Minimum Operating Temperature C

0

Standard Package Name

DIM

Package Width

3.7(Max)

Package Length

69.6

Maximum Clock Rate Mhz

2400

Module Type

260SODIMM

Lead Shape

No Lead

Supplier Temperature Grade

Commercial

Module Density

4Gbyte

Pcb Changed

260

Number Of Ranks

Single

Data Bus Width Bit

64

Ecc Support

No

Maximum Operating Temperature C

85

RoHS Durumu

RoHS Compliant

Parça Durumu

Active

Chip Density Bit

8G