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Priced by quantity and lead time.
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Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Module
- DRAM Module
- Supplier Package
- USODIMM
- Chip Package Type
- 78FBGA
- Cas Latency
- 17
- Maximum Operating Supply Voltage V
- 1.26
- Organization
- 512Mx64
- Typical Operating Supply Voltage V
- 1.2
- Chip Configuration
- 512Mx8
- Hts
- 8473.30.11.40
- Eccn Us
- EAR99
- Package Height
- 30
- Number Of Chip Per Module
- 8
- Mounting
- Socket
- Pin Sayısı
- 260
- Operating Current Ma
- 840
- Module Type
- 260USODIMM
- Maximum Clock Rate Mhz
- 2400
- Package Length
- 69.6
- Package Width
- 3.7(Max)
- Ecc Support
- No
- Chip Density Bit
- 4G
- Module Density
- 4Gbyte
- Number Of Ranks
- Single
- Data Bus Width Bit
- 64
- Pcb Changed
- 260
- Minimum Operating Supply Voltage V
- 1.14
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