M470T5663QZ3-CF700

Specifications

Package Width

3.8(Max)

Mounting

Socket

Package Length

67.6

Eccn Us

4A994.a

Package Height

30

Operating Current Ma

1360

Number Of Chip Per Module

16

Spd Eeprom Support

Yes

Chip Package Type

FBGA

Supplier Package

USODIMM

Maximum Clock Rate Mhz

800

Pll

No

Self Refresh

Yes

Minimum Operating Supply Voltage V

1.7

Maximum Operating Supply Voltage V

1.9

Pin Sayısı

200

Supplier Temperature Grade

Commercial

Pcb Changed

200

Ecc Support

No

Parça Durumu

Obsolete

Max Access Time Ns

0.4

Minimum Operating Temperature C

0

Module Density

2Gbyte

Hts

8542.32.00.24

Module Type

200USODIMM

Chip Configuration

128Mx8

Chip Density Bit

1G

Number Of Ranks

Dual

Cas Latency

6

Module

DRAM Module

Typical Operating Supply Voltage V

1.8

Data Bus Width Bit

64

Maximum Operating Temperature C

95

Number Of Chip Banks

8

Module Sides

Double

Lead Shape

No Lead

RoHS Durumu

RoHS Compliant

Organization

256Mx64

Standard Package Name

DIM