M470T5267AZ3-CF7DE

Specifications

Module

DRAM Module

Typical Operating Supply Voltage V

1.8

Data Bus Width Bit

64

Number Of Chip Banks

8

Maximum Operating Temperature C

95

Chip Configuration

512Mx8

Chip Density Bit

4G(Stacked)

Cas Latency

6

Number Of Ranks

Dual

RoHS Durumu

RoHS Compliant

Organization

512Mx64

Standard Package Name

DIM

Module Sides

Double

Lead Shape

No Lead

Supplier Temperature Grade

Commercial

Pcb Changed

200

Ecc Support

No

Module Density

4Gbyte

Module Type

200SODIMM

Parça Durumu

Obsolete

Max Access Time Ns

0.4

Minimum Operating Temperature C

0

Supplier Package

USODIMM

Maximum Clock Rate Mhz

800

Pll

No

Chip Package Type

FBGA

Minimum Operating Supply Voltage V

1.7

Maximum Operating Supply Voltage V

1.9

Pin Sayısı

200

Self Refresh

Yes

Package Height

30

Package Width

3.8(Max)

Mounting

Socket

Eccn Us

4A994.a

Package Length

67.6

Spd Eeprom Support

Yes

Operating Current Ma

2080

Number Of Chip Per Module

16