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C3 ChipZentronix
M470T2864QZ3-CF700

Samsung Electronics

M470T2864QZ3-CF700

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Technical team support

Specifications

Self Refresh
Yes
Maximum Operating Supply Voltage V
1.9
Pin Sayısı
200
Minimum Operating Supply Voltage V
1.7
Chip Package Type
FBGA
Ambalaj
Tray
Pll
No
Maximum Clock Rate Mhz
800
Supplier Package
USODIMM
Number Of Chip Per Module
8
Operating Current Ma
840
Spd Eeprom Support
Yes
Package Length
67.6
Eccn Us
4A994.a
Mounting
Socket
Package Width
3.8(Max)
Package Height
30
Lead Shape
No Lead
Module Sides
Double
Standard Package Name
DIM
RoHS Durumu
RoHS Compliant
Organization
128Mx64
Number Of Ranks
Dual
Cas Latency
6
Chip Configuration
64Mx16
Chip Density Bit
1G
Maximum Operating Temperature C
95
Number Of Chip Banks
8
Data Bus Width Bit
64
Typical Operating Supply Voltage V
1.8
Module
DRAM Module
Minimum Operating Temperature C
0
Parça Durumu
Obsolete
Max Access Time Ns
0.4
Hts
8542.32.00.24
Module Type
200USODIMM
Module Density
1Gbyte
Ecc Support
No
Supplier Temperature Grade
Commercial
Pcb Changed
200

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