M393B4G70BM0-YH9

Specifications

Cas Latency

9

Module

DRAM Module

Maximum Operating Temperature C

95

Ecc Support

Yes

RoHS

Non-Compliant

Parça Durumu

Obsolete

Package Width

4(Max)

Package Height

30

Package Length

133.35

Operating Current Ma

3744

Chip Density Bit

8G

Eccn Us

4A994.a

Number Of Chip Banks

8

Minimum Operating Supply Voltage V

1.283/1.425

Maximum Operating Supply Voltage V

1.45/1.575

Supplier Package

RDIMM

Chip Package Type

FBGA

Chip Configuration

2Gx4

Pll

No

Module Type

240RDIMM

Maximum Clock Rate Mhz

1333

Minimum Operating Temperature C

0

Number Of Chip Per Module

36

Organization

4Gx72

Self Refresh

Yes

Data Bus Width Bit

72

Module Sides

Double

Pcb Changed

240

Spd Eeprom Support

Yes

Typical Operating Supply Voltage V

1.35/1.5

Pin Sayısı

240

Mounting

Socket

Max Access Time Ns

0.255

RoHS Durumu

RoHS Compliant

Number Of Ranks

Quad

Module Density

32Gbyte