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C3 ChipZentronix
M393B2G70DB0-YH9

Samsung Electronics

M393B2G70DB0-YH9

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Technical team support

Specifications

RoHS Durumu
RoHS Compliant
Number Of Ranks
Dual
Module Density
16Gbyte
Pin Sayısı
240
Mounting
Socket
Lead Shape
No Lead
Typical Operating Supply Voltage V
1.35
Organization
2Gx72
Data Bus Width Bit
72
Pcb Changed
240
Module Sides
Double
Supplier Temperature Grade
Commercial
Maximum Clock Rate Mhz
1333
Module Type
240RDIMM
Minimum Operating Temperature C
0
Number Of Chip Per Module
36
Chip Configuration
1Gx4
Chip Package Type
FBGA
Supplier Package
RDIMM
Standard Package Name
DIMM
Package Width
4(Max)
Parça Durumu
Obsolete
Package Height
30
Package Length
133.35
Eccn Us
4A994.a
Chip Density Bit
4G
Cas Latency
9
Module
DRAM Module
Maximum Operating Temperature C
85
Ecc Support
No

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