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C3 ChipZentronix
M393B2G70BH0-CH9

Samsung Electronics

M393B2G70BH0-CH9

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Cas Latency
9
Module
DRAM Module
Ecc Support
Yes
Maximum Operating Temperature C
95
Parça Durumu
Obsolete
Package Width
4(Max)
Package Height
30
Package Length
133.35
Operating Current Ma
2480
Eccn Us
4A994.a
Chip Density Bit
4G
Number Of Chip Banks
8
Minimum Operating Supply Voltage V
1.425
Maximum Operating Supply Voltage V
1.575
Supplier Package
RDIMM
Chip Package Type
FBGA
Chip Configuration
1Gx4
Standard Package Name
DIMM
Pll
No
Module Type
240RDIMM
Maximum Clock Rate Mhz
1333
Minimum Operating Temperature C
0
Number Of Chip Per Module
36
Organization
2Gx72
Self Refresh
Yes
Data Bus Width Bit
72
Module Sides
Double
Pcb Changed
240
Spd Eeprom Support
Yes
Typical Operating Supply Voltage V
1.5
Pin Sayısı
240
Mounting
Socket
Max Access Time Ns
20
Lead Shape
No Lead
RoHS Durumu
RoHS Compliant
Number Of Ranks
Dual
Module Density
16Gbyte

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