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C3 ChipZentronix
M393B1G73EB0-CMA

Samsung Electronics

M393B1G73EB0-CMA

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Specifications

RoHS Durumu
RoHS Compliant
Number Of Ranks
Dual
Module Density
8Gbyte
Pin Sayısı
240
Mounting
Socket
Max Access Time Ns
20
Lead Shape
No Lead
Spd Eeprom Support
Yes
Typical Operating Supply Voltage V
1.5
Organization
1Gx72
Self Refresh
Yes
Data Bus Width Bit
72
Module Sides
Double
Pcb Changed
240
Module Type
240RDIMM
Maximum Clock Rate Mhz
670
Minimum Operating Temperature C
0
Number Of Chip Per Module
18
Minimum Operating Supply Voltage V
1.425
Maximum Operating Supply Voltage V
1.575
Chip Package Type
FBGA
Supplier Package
RDIMM
Chip Configuration
512Mx8
Standard Package Name
DIMM
Hts
8473.30.11.40
Pll
No
Package Width
4(Max)
Parça Durumu
Active
Package Length
133.35
Package Height
30
Operating Current Ma
1390
Chip Density Bit
4G
Eccn Us
4A994.a
Cas Latency
13
Module
DRAM Module
Ecc Support
Yes
Maximum Operating Temperature C
95

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