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C3 ChipZentronix
M391B5273DH0-YH9

Samsung Electronics

M391B5273DH0-YH9

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Technical team support

Specifications

Cas Latency
9
Package Width
4(Max)
Max Access Time Ns
0.255
Module Sides
Double
Supplier Package
UDIMM
Pll
No
Pcb Changed
240
Eccn Us
4A994.a
Chip Configuration
256Mx8
Chip Density Bit
2G
Mounting
Socket
Package Height
30
Ecc Support
Yes
Data Bus Width Bit
72
Number Of Chip Banks
8
Typical Operating Supply Voltage V
1.35/1.5
Chip Package Type
FBGA
Number Of Ranks
Dual
RoHS Durumu
RoHS Compliant
Module Density
4Gbyte
Minimum Operating Supply Voltage V
1.28/1.425
Maximum Operating Temperature C
90
Maximum Clock Rate Mhz
1333
Spd Eeprom Support
Yes
Parça Durumu
Obsolete
Lead Shape
No Lead
Module
DRAM Module
Operating Current Ma
900
Pin Sayısı
240
Organization
512Mx72
Package Length
133.35
Standard Package Name
DIM
Minimum Operating Temperature C
0
Self Refresh
Yes
Module Type
240UDIMM
Maximum Operating Supply Voltage V
1.45/1.575
Number Of Chip Per Module
18

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