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C3 ChipZentronix
M386B4G70DM0-CMA30

Samsung Electronics

M386B4G70DM0-CMA30

Memory Cards

RoHS: Compliant

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RoHS

Compliant

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Specifications

Package Height
30.35
Eccn Us
4A994.a
Number Of Ranks
Quad
Typical Operating Supply Voltage V
1.5
Parça Durumu
Obsolete
Package Width
4.8(Max)
Pcb Changed
240
Data Bus Width Bit
72
Chip Density Bit
8G
Supplier Package
LRDIMM
Module
DRAM Module
Maximum Operating Temperature C
85
Maximum Clock Rate Mhz
1866
Mounting
Socket
Minimum Operating Temperature C
0
Module Density
32Gbyte
Chip Configuration
2Gx4
Package Length
133.35
Ecc Support
No
Module Type
240LRDIMM
Chip Package Type
78FBGA
Organization
4Gx72
Pin Sayısı
240
Module Sides
Double
Cas Latency
13
Number Of Chip Per Module
36
Supplier Temperature Grade
Commercial

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