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C3 ChipZentronix
M386B4G70DM0-CMA

Samsung Electronics

M386B4G70DM0-CMA

Memory Cards

RoHS: Compliant

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Compliant

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Specifications

Pin Sayısı
240
Organization
4Gx72
Module Sides
Double
Chip Package Type
78FBGA
Ecc Support
No
Module Type
240LRDIMM
Package Length
133.35
Number Of Chip Per Module
36
Supplier Temperature Grade
Commercial
Cas Latency
13
Maximum Operating Temperature C
85
Supplier Package
LRDIMM
Module
DRAM Module
Maximum Clock Rate Mhz
1866
Pcb Changed
240
Package Width
4.8(Max)
Chip Density Bit
8G
Data Bus Width Bit
72
Hts
8473.30.11.40
Number Of Ranks
Quad
Eccn Us
4A994.a
Package Height
30.35
Parça Durumu
Obsolete
Typical Operating Supply Voltage V
1.5
Chip Configuration
2Gx4
Module Density
32Gbyte
Minimum Operating Temperature C
0
Mounting
Socket

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