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ROHM Semiconductor

HS8MA2TCR1

MOSFETs Transistors Arrays

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Specifications

Pd Power Dissipation
4 W
Typical Turnoff Delay Time
12 ns, 27.6 ns
Qg Gate Charge
7.8 nC, 8.4 nC
Vgs Th Gatesource Threshold Voltage
2.5 V
Vgs Gatesource Voltage
- 20 V, + 20 V
Montaj Tipi
Surface Mount
Rise Time
8 ns, 16.8 ns
Package Type
DFN3333-9DC
Rds On Max Id Vgs
80mOhm @ 5.5A, 10V, 35mOhm @ 7A, 10V
Number Of Channels
2 Channel
Minimum Operating Temperature
- 55 C
Channel Mode
Enhancement
Input Capacitance Ciss Max Vds
320pF @ 10V, 365pF @ 10V
Number Of Elements Per Chip
2
Typical Turnon Delay Time
7.2 ns, 7.9 ns
Vgsth Max Id
2.5V @ 1mA
Çalışma Sıcaklığı
150°C (TJ)
Continuous Drain Current Id
7A
Maks. Çalışma Sıcaklığı
+ 150 C
Tedarikçi Cihaz Paketi
DFN3333-9DC
Drain To Source Voltage Vdss
30V
Rds On Drainsource Resistance
35 mOhms, 80 mOhms
Fet Type
N and P-Channel
Technology
Si
Fet Feature
Standard
Ambalaj
Cut Tape
Paket
Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Vds Drainsource Breakdown Voltage
30 V
Kılıf / Paket
HSML3333L-9
Transistor Type
Power MOSFET
Power Max
2W (Ta)
Id Continuous Drain Current
5.5 A, 7 A
Configuration
Dual
Ürün Tipi
MOSFET
Ürün Durumu
Active
Transistor Polarity
N and P Channel
Gate Charge Qg Max Vgs
7.8nC @ 10V, 8.4nC @ 10V
RoHS
Details
Fabrika Paket Adedi
1000
Channel Type
N, P

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