MPC8560VT833LC

Specifications

Operating Temperaturemax

105 °C

Package Shape

SQUARE

Ethernet

10/100/1000Mbps (2)

Terminal Kaplaması

TIN COPPER/TIN SILVER

Additional Interfaces

I2C, PCI, RapidIO, SPI, TDM, UART

Tepe Reflow Sıcaklığı (°C)

260

Uzunluk

29 mm

Package Description

29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783

Clock Frequency

166MHz

Voltage Io

2.5V 3.3V

Package Code

BGA

Supply Voltagemin

1.14 V

Address Bus Width

64

Temperature Grade

OTHER

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Boundary Scan

YES

Ambalaj

Tray

REACH Uyumluluk Kodu

unknown

Number Of Terminals

783

Terminal Formu

BALL

Tepe Reflow Süresi (maks. sn)

40

Genişlik

29 mm

Parça Durumu

Obsolete

Kurşunsuz Kodu

No

JESD-609 Kodu

e2

Terminal Adımı

1 mm

Low Power Mode

YES

Core Processor

PowerPC e500

Package Body Material

PLASTIC/EPOXY

Supply Voltagemin Vsup

1.14V

Part Package Code

BGA

Çalışma Sıcaklığı

0°C~105°C TA

Yüzey Montaj

YES

Qualification Status

COMMERCIAL

Number Of Coresbus Width

1 Core 32-Bit

Package Style

GRID ARRAY

HTS Kodu

8542.31.00.01

ECCN Kodu

3A991.A.2

External Data Bus Width

64

Kılıf / Paket

784-BBGA, FCBGA