FDG313N

Specifications

Tepe Reflow Süresi (maks. sn)

30

Vgs Max

±8V

Power Dissipation

750mW

Rohs Code

Yes

Drain To Source Breakdown Voltage

25V

Rds On Max Id Vgs

450m Ω @ 500mA, 4.5V

Pin Sayısı

6

Montaj

Surface Mount

Kılıf / Paket

6-TSSOP, SC-88, SOT-363

Kurşunsuz

Lead Free

Kurşunsuz Kodu

Yes

Drain Currentmax Id

0.95 A

Qualification Status

COMMERCIAL

Part Package Code

SC-70

Tepe Reflow Sıcaklığı (°C)

260

Pin Sayısı

6

Uzunluk

2mm

Drive Voltage Max Rds On Min Rds On

2.7V 4.5V

Vgsth Max Id

1.5V @ 250μA

Terminal Pozisyonu

DUAL

Package Body Material

PLASTIC/EPOXY

Voltage Rated Dc

25V

Exterior Housing Material

1

Drainsource On Resistancemax

0.45 Ω

Rise Time

8.5ns

Number Of Terminals

6

Centertocenter Distance

46 mm

Lifecycle Status

LAST SHIPMENTS (Last Updated: 2 days ago)

Connector Type

Screw terminal block with cover

Turn On Delay Time

3 ns

Gate Charge Qg Max Vgs

2.3nC @ 4.5V

Montaj Tipi

Surface Mount

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Reach Svhc

No SVHC

Terminal Sayısı

6

Operating Temperature Range

-40 …+80 °C

Gross Weight

28.10

Fet Technology

METAL-OXIDE SEMICONDUCTOR

Nominal Voltage

600 V

Element Configuration

Single