Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Interface
- LVTTL
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Terminal Formu
- BALL
- JESD-609 Kodu
- e0
- Fonksiyon Sayısı
- 1
- Seri
- HOTlink II™
- Part Package Code
- BGA
- Temel Parça No
- CY*15G04
- Supply Voltagenom
- 3.3 V
- Technology
- BICMOS
- REACH Uyumluluk Kodu
- unknown
- Pin Sayısı
- 256
- Parça Durumu
- Obsolete
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Uzunluk
- 27mm
- Number Of Terminals
- 256
- Package Style
- GRID ARRAY
- RoHS Durumu
- Non-RoHS Compliant
- Yayın Yılı
- 2005
- Yüzey Montaj
- YES
- Ihs Manufacturer
- ROCHESTER ELECTRONICS LLC
- Terminal Sayısı
- 256
- Üretici Parça No
- CYP15G0401TB-BGI
- Package Description
- 27 X 27 MM, 1.57 MM HEIGHT, TBGA-256
- Kurşunsuz Kodu
- no
- Montaj
- Surface Mount
- RoHS
- YES
- Package Body Material
- PLASTIC/EPOXY
- Terminal Kaplaması
- TIN LEAD
- Nominal Supply Current
- 820mA
- Seated Heightmax
- 1.745 mm
- Package Code
- BGA
- Telecom Ic Type
- TELECOM CIRCUIT
- Çalışma Sıcaklığı
- -40°C~85°C
- Temel Ürün No
- CYP15G0401
- Moisture Sensitivity Levels
- NOT SPECIFIED
- Genişlik
- 27mm
- Number Of Circuits
- 4
- Operating Temperaturemin
- -40 °C
- Rohs Code
- No
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