Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- RoHS Durumu
- Non-RoHS Compliant
- Number Of Terminals
- 256
- Package Style
- GRID ARRAY
- Pin Sayısı
- 256
- Parça Durumu
- Obsolete
- Uzunluk
- 27mm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- REACH Uyumluluk Kodu
- unknown
- Technology
- BICMOS
- Supply Voltagenom
- 3.3 V
- Pin Sayısı
- 256
- Temel Parça No
- CY*15G04
- Part Package Code
- BGA
- Seri
- HOTlink II™
- Fonksiyon Sayısı
- 1
- JESD-609 Kodu
- e0
- Terminal Formu
- BALL
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Interface
- LVTTL
- Package Body Material
- PLASTIC/EPOXY
- Terminal Kaplaması
- TIN LEAD
- Nominal Supply Current
- 740mA
- Montaj
- Surface Mount
- Kurşunsuz Kodu
- no
- Üretici Parça No
- CYP15G0401RB-BGI
- Package Description
- 27 X 27 MM, 1.57 MM HEIGHT, BGA-256
- Terminal Sayısı
- 256
- Yüzey Montaj
- YES
- Ihs Manufacturer
- ROCHESTER ELECTRONICS LLC
- Yayın Yılı
- 2005
- Jesd30 Code
- S-PBGA-B256
- Function
- Receiver
- Ürün Durumu
- Obsolete
- Besleme Gerilimi
- 3.135V~3.465V
- Paket
- Tray
- Risk Rank
- 5.67
- Kılıf / Paket
- 256-LBGA Exposed Pad
- Rohs Code
- No
- Temperature Grade
- INDUSTRIAL
- Operating Temperaturemin
- -40 °C
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