Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Technology
- BICMOS
- Supply Voltagenom
- 3.3 V
- Uzunluk
- 27mm
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Pin Sayısı
- 256
- Parça Durumu
- Obsolete
- REACH Uyumluluk Kodu
- unknown
- Package Style
- GRID ARRAY
- Number Of Terminals
- 256
- RoHS Durumu
- Non-RoHS Compliant
- Gerilim
- 125V
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Interface
- LVTTL
- Kapasitans
- 64uF
- Terminal Formu
- BALL
- JESD-609 Kodu
- e0
- Fonksiyon Sayısı
- 1
- Temel Parça No
- CY*15G04
- Pin Sayısı
- 256
- Part Package Code
- BGA
- Seri
- HOTlink II™
- Montaj
- Surface Mount
- Nominal Supply Current
- 690mA
- Terminal Kaplaması
- TIN LEAD
- Package Body Material
- PLASTIC/EPOXY
- Ihs Manufacturer
- ROCHESTER ELECTRONICS LLC
- Yüzey Montaj
- YES
- Yayın Yılı
- 2005
- Package Description
- 27 X 27 MM, 1.57 MM HEIGHT, BGA-256
- Üretici Parça No
- CYP15G0401RB-BGC
- Terminal Sayısı
- 256
- Tolerans
- -0%/+20%
- Kurşunsuz Kodu
- no
- Number Of Circuits
- 4
- Maks. Oturma Yüksekliği
- 2.750in
- Genişlik
- 27mm
- Moisture Sensitivity Levels
- NOT SPECIFIED
- Risk Rank
- 5.08
- Kılıf / Paket
- 256-LBGA Exposed Pad
- Rohs Code
- No
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