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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Part Life Cycle Code
- Not Recommended
- Terminal Formu
- BALL
- Family
- SSTV
- Output Polarity
- TRUE
- Logic Ic Type
- D FLIP-FLOP
- Package Style
- GRID ARRAY, LOW PROFILE, FINE PITCH
- Terminal Adımı
- 0.8 mm
- Uzunluk
- 16 mm
- Package Body Material
- PLASTIC/EPOXY
- Number Of Terminals
- 114
- Terminal Pozisyonu
- BOTTOM
- Operating Temperaturemax
- 70 °C
- Supply Voltagemin Vsup
- 2.3 V
- Fonksiyon Sayısı
- 1
- Propagation Delay Tpd
- 3.1 ns
- Ihs Manufacturer
- RENESAS ELECTRONICS CORP
- Package Shape
- RECTANGULAR
- Package Equivalence Code
- BGA114,6X19,32
- Package Code
- LFBGA
- Fmaxmin
- 200 MHz
- Supply Voltagenom Vsup
- 2.5 V
- REACH Uyumluluk Kodu
- compliant
- Temperature Grade
- COMMERCIAL
- Genişlik
- 5.5 mm
- Part Package Code
- BGA
- HTS Kodu
- 8542.39.00.01
- Qualification Status
- Not Qualified
- Pin Sayısı
- 114
- Number Of Bits
- 24
- Supply Voltagemax Vsup
- 2.7 V
- Trigger Type
- POSITIVE EDGE
- Package Description
- LFBGA,
- Yüzey Montaj
- YES
- Seated Heightmax
- 1.4 mm
- Jesd30 Code
- R-PBGA-B114