89TTM553BL

Specifications

JESD-609 Kodu

e0

Terminal Pozisyonu

BOTTOM

Seated Heightmax

3.29 mm

Temperature Grade

OTHER

HTS Kodu

8542.39.00.01

RoHS

Non-Compliant

Terminal Kaplaması

TIN LEAD

Package Body Material

PLASTIC/EPOXY

Qualification Status

Not Qualified

Terminal Formu

BALL

Uzunluk

35 mm

ECCN Kodu

5A991

Üretici Parça No

89TTM553BL

Genişlik

35 mm

Pin Sayısı

960

REACH Uyumluluk Kodu

not_compliant

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT

Tepe Reflow Sıcaklığı (°C)

225

Operating Temperaturemax

85 °C

Number Of Terminals

960

Radyasyon Dayanımı

No

Reflow Temperaturemax S

30

Rohs Code

No

Supply Voltagenom

1.8 V

Supply Voltagemin

1.71 V

Jesd30 Code

S-PBGA-B960

Min Supply Voltage

1.71 V

Package Code

BGA

Package Style

GRID ARRAY

Part Life Cycle Code

Obsolete

Risk Rank

5.69

Max Supply Voltage

1.89 V

Operating Supply Voltage

1.8 V

Package Description

35 X 35 MM, 1 MM PITCH, FPBGA-960

Package Shape

SQUARE

Part Package Code

BGA

Yüzey Montaj

YES

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltagemax

1.89 V