89TSF552BL

Specifications

Package Description

35 X 35 MM, 1 MM PITCH, FPBGA-960

Package Shape

SQUARE

Kurşunsuz Kodu

No

Part Package Code

BGA

Yüzey Montaj

YES

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltagemax

1.89 V

Rohs Code

No

Supply Voltagenom

1.8 V

Part Life Cycle Code

Active

Risk Rank

5.72

Jesd30 Code

S-PBGA-B960

Supply Voltagemin

1.71 V

Package Code

BGA

Package Style

GRID ARRAY

Üretici Parça No

89TSF552BL

Genişlik

35 mm

REACH Uyumluluk Kodu

compliant

Pin Sayısı

960

Qualification Status

Not Qualified

Uzunluk

35 mm

Terminal Formu

BALL

Operating Temperaturemax

85 °C

Number Of Terminals

960

Reflow Temperaturemax S

30

Upsucsperipheral Ics Type

MICROPROCESSOR CIRCUIT

Tepe Reflow Sıcaklığı (°C)

225

Seated Heightmax

3.29 mm

Temperature Grade

OTHER

JESD-609 Kodu

e0

Terminal Pozisyonu

BOTTOM

Package Body Material

PLASTIC/EPOXY

HTS Kodu

8542.31.00.01

Terminal Kaplaması

Tin/Lead (Sn/Pb)