UPD800261F1-816-HN2-A

Specifications

Rohs Code

Yes

Terminal Pozisyonu

BOTTOM

Part Life Cycle Code

Active

Package Code

LFBGA

Number Of Terminals

304

Upsucsperipheral Ics Type

MICROPROCESSOR, RISC

Boundary Scan

YES

Operating Temperaturemax

85 °C

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

External Data Bus Width

32

Speed

150 MHz

Format

FIXED POINT

Terminal Adımı

0.8 mm

Part Package Code

BGA

Temperature Grade

INDUSTRIAL

ECCN Kodu

3A001.A.3

Integrated Cache

YES

Uzunluk

19 mm

Seated Heightmax

1.58 mm

Yüzey Montaj

YES

Supply Voltagemin

1.35 V

Supply Voltagemax

1.65 V

Address Bus Width

24

Supply Currentmax

535 mA

Power Supplies

1.5 V

Jesd30 Code

S-PBGA-B304

REACH Uyumluluk Kodu

compliant

Operating Temperaturemin

-40 °C

Package Description

LFBGA, BGA304,22X22,32

Pin Sayısı

304

Package Shape

SQUARE

Additional Feature

IT ALSO OPERATES AT 3.3V I/O SUPPLY

Package Equivalence Code

BGA304,22X22,32

Technology

MOS

Risk Rank

5.46

Low Power Mode

NO

Terminal Formu

BALL

Package Body Material

PLASTIC/EPOXY

Supply Voltagenom

1.5 V

Bit Size

32