Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Style
- GRID ARRAY, HEAT SINK/SLUG
- Jesd30 Code
- R-XBGA-B28
- Operating Temperaturemax
- 70 °C
- Rohs Code
- Yes
- Supply Voltagenom
- 3.6 V
- Pin Sayısı
- 3
- Genişlik
- 5 mm
- Part Life Cycle Code
- Obsolete
- Çalışma Sıcaklığı
- -40...163°C
- Kind Of Connector
- female
- Contacts Pitch
- 2.54mm
- REACH Uyumluluk Kodu
- compliant
- Tepe Reflow Sıcaklığı (°C)
- 260
- Profile
- beryllium copper
- Contact Plating
- gold-plated
- Fonksiyon Sayısı
- 1
- Package Shape
- RECTANGULAR
- Ihs Manufacturer
- QORVO INC
- Electrical Mounting
- THT
- Plating Thickness
- 0.254µm
- Seated Heightmax
- 1.215 mm
- Tepe Reflow Süresi (maks. sn)
- 30
- Connector
- socket
- Terminal Pozisyonu
- BOTTOM
- Yüzey Montaj
- YES
- Uzunluk
- 5.5 mm
- Telecom Ic Type
- TELECOM CIRCUIT
- Temperature Grade
- OTHER
- Connector Pinout Layout
- 1x3
- Package Body Material
- UNSPECIFIED
- Type Of Connector
- pin strips
- Akım Değeri
- 1.5A
- Terminal Formu
- BUTT
- Package Code
- HLGA
- Operating Temperaturemin
- -30 °C
- HTS Kodu
- 8542.39.00.01
- Number Of Terminals
- 28
- Spatial Orientation
- straight
- Rated Voltage
- 60V
- Package Description
- HLGA,
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