Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Body Material
- UNSPECIFIED
- Ihs Manufacturer
- QORVO INC
- Package Description
- HBCC,
- Genişlik
- 3 mm
- Telecom Ic Type
- RF AND BASEBAND CIRCUIT
- Package Style
- CHIP CARRIER, HEAT SINK/SLUG
- Jesd30 Code
- S-XBCC-B10
- Tepe Reflow Sıcaklığı (°C)
- NOT SPECIFIED
- Part Life Cycle Code
- Obsolete
- Terminal Pozisyonu
- BOTTOM
- Tepe Reflow Süresi (maks. sn)
- NOT SPECIFIED
- Package Code
- HBCC
- Package Shape
- SQUARE
- Rohs Code
- Yes
- Uzunluk
- 3 mm
- Part Package Code
- MODULE
- Yüzey Montaj
- YES
- Seated Heightmax
- 1.015 mm
- Terminal Formu
- BUTT
- Fonksiyon Sayısı
- 1
- Number Of Terminals
- 10
- Operating Temperaturemax
- 85 °C
- Qualification Status
- Not Qualified
- Pin Sayısı
- 10
- REACH Uyumluluk Kodu
- compliant
- Operating Temperaturemin
- -25 °C
- HTS Kodu
- 8542.39.00.01
- Temperature Grade
- OTHER
- Terminal Adımı
- 0.6 mm
- Supply Voltagenom
- 3.4 V
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