Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Code
- DIP
- Memory Width
- 8
- Number Of Words
- 512 words
- ECCN Kodu
- EAR99
- Operating Temperaturemax
- 70 °C
- Organization
- 512X8
- Package Shape
- RECTANGULAR
- Temperature Grade
- COMMERCIAL
- Package Style
- IN-LINE
- Supply Voltagenom Vsup
- 5 V
- JESD-609 Kodu
- e0
- Terminal Adımı
- 2.54 mm
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Supply Currentmax
- 0.175 mA
- Yüzey Montaj
- NO
- REACH Uyumluluk Kodu
- unknown
- Terminal Pozisyonu
- DUAL
- Number Of Words Code
- 512
- Package Body Material
- CERAMIC
- Package Equivalence Code
- DIP24,.6
- Jesd30 Code
- R-XDIP-T24
- Part Life Cycle Code
- Transferred
- Package Description
- DIP, DIP24,.6
- HTS Kodu
- 8542.32.00.71
- Memory Density
- 4096 bit
- Qualification Status
- Not Qualified
- Rohs Code
- No
- Number Of Terminals
- 24
- Access Timemax
- 45 ns
- Ihs Manufacturer
- PHILIPS SEMICONDUCTORS
- Terminal Formu
- THROUGH-HOLE
- Memory Ic Type
- OTP ROM
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