Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Temperature Grade
- COMMERCIAL
- Package Shape
- RECTANGULAR
- Organization
- 1KX4
- ECCN Kodu
- EAR99
- Operating Temperaturemax
- 70 °C
- Package Code
- DIP
- Memory Width
- 4
- Number Of Words
- 1024 words
- JESD-609 Kodu
- e0
- Supply Voltagenom Vsup
- 5 V
- Package Style
- IN-LINE
- Terminal Pozisyonu
- DUAL
- REACH Uyumluluk Kodu
- unknown
- Yüzey Montaj
- NO
- Terminal Kaplaması
- Tin/Lead (Sn/Pb)
- Terminal Adımı
- 2.54 mm
- Package Body Material
- CERAMIC
- Number Of Words Code
- 1000
- Package Equivalence Code
- DIP18,.3
- Memory Density
- 4096 bit
- HTS Kodu
- 8542.32.00.71
- Package Description
- DIP, DIP18,.3
- Part Life Cycle Code
- Transferred
- Jesd30 Code
- R-XDIP-T18
- Access Timemax
- 35 ns
- Number Of Terminals
- 18
- Rohs Code
- No
- Qualification Status
- Not Qualified
- Memory Ic Type
- OTP ROM
- Terminal Formu
- THROUGH-HOLE
- Ihs Manufacturer
- PHILIPS SEMICONDUCTORS
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