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Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Package Shape
- RECTANGULAR
- Tepe Reflow Süresi (maks. sn)
- 30
- Seated Heightmax
- 1.75 mm
- Ihs Manufacturer
- PHILIPS SEMICONDUCTORS
- Part Life Cycle Code
- Transferred
- Fonksiyon Sayısı
- 2
- Pin Sayısı
- 16
- Temperature Grade
- INDUSTRIAL
- Max Iol
- 0.004 A
- Moisture Sensitivity Levels
- 1
- Package Body Material
- PLASTIC/EPOXY
- Packing Method
- TR
- Package Style
- SMALL OUTLINE
- Number Of Bits
- 2
- Output Polarity
- COMPLEMENTARY
- Fmaxmin
- 24 MHz
- Terminal Pozisyonu
- DUAL
- Package Equivalence Code
- SOP16,.25
- Supply Voltagemin Vsup
- 2 V
- Part Package Code
- SOIC
- Operating Temperaturemax
- 85 °C
- Logic Ic Type
- J-K FLIP-FLOP
- Load Capacitance Cl
- 50 pF
- Genişlik
- 3.9 mm
- Package Code
- SOP
- HTS Kodu
- 8542.39.00.01
- REACH Uyumluluk Kodu
- unknown
- Max Frequencynomsup
- 24000000 Hz
- Operating Temperaturemin
- -40 °C
- Number Of Terminals
- 16
- Tepe Reflow Sıcaklığı (°C)
- 260
- JESD-609 Kodu
- e4
- Propagation Delay Tpd
- 265 ns
- Supply Voltagenom Vsup
- 4.5 V
- Qualification Status
- Not Qualified
- Supply Voltagemax Vsup
- 6 V
- Uzunluk
- 9.9 mm
- Terminal Adımı
- 1.27 mm
- Family
- HC/UH
- Terminal Kaplaması
- Nickel/Palladium/Gold (Ni/Pd/Au)