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C3 ChipZentronix

Philips Semiconductors

74AUP1G79GW

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RoHS: Compliant

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RoHS

Compliant

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Specifications

Transport Packaging Sizequantity
25*21*19/350
Gross Weight
43.83
Terminal Adımı
0.635 mm
Packing Method
TR
Supply Voltagenom Vsup
1.1 V
HTS Kodu
8542.39.00.01
Load Capacitance Cl
30 pF
Number Of Terminals
5
Supply Voltagemin Vsup
0.8 V
Package Equivalence Code
TSSOP5/6,.08
Operating Temperaturemax
125 °C
Family
AUP/ULP/V
Output Polarity
TRUE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Seated Heightmax
1.1 mm
Max Iol
0.0017 A
Ambalaj
10 pcs in a bag
Logic Ic Type
D FLIP-FLOP
Package Code
TSSOP
Package Shape
RECTANGULAR
Tepe Reflow Süresi (maks. sn)
30
Terminal Formu
GULL WING
Terminal Kaplaması
TIN
Genişlik
1.25 mm
Temperature Grade
AUTOMOTIVE
Qualification Status
Not Qualified
Depth
60 mm
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
JESD-609 Kodu
e3
Rohs Code
Yes
Max Frequencynomsup
128000000 Hz
Package Body Material
PLASTIC/EPOXY
Part Life Cycle Code
Transferred
Fmaxmin
510 MHz
Supply Voltagemax Vsup
3.6 V
Saturation Current
1
Tepe Reflow Sıcaklığı (°C)
260
REACH Uyumluluk Kodu
unknown
Material
carbon steel galvanized, yellow color
Uzunluk
2.05 mm

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