MC100EP08DTR2

Specifications

JESD-609 Kodu

e0

Number Of Elements Per Chip

1

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

RoHS Durumu

RoHS non-compliant

Family

100E

Maximum Operating Supply Voltage V

-5.5|5.5

Number Of Element Inputs

4-IN

Package Description

PLASTIC, TSSOP-8

Package Length

3.1(Max)

Seated Heightmax

1.1 mm

Terminal Kaplaması

Tin/Lead (Sn90Pb10)

Part Life Cycle Code

Obsolete

Supply Voltagemin Vsup

3 V

Logic Function

XOR/XNOR

Terminal Formu

GULL WING

Absolute Propagation Delay Time Ns

0.32

Package Height

0.95(Max)

Minimum Operating Temperature C

-40

Number Of Selection Inputs Per Element

0

Supplier Package

TSSOP

Operating Temperaturemax

85 °C

Ihs Manufacturer

ON SEMICONDUCTOR

Packing Method

TAPE AND REEL

Package Equivalence Code

TSSOP8,.19

Operating Temperaturemin

-40 °C

Lead Shape

Gull-wing

Additional Feature

NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V

Power Supplies

-4.5 V

Maximum Propagation Delay Time Maximum Cl Ns

0.3@3V to 5.5V

Technology

ECL

Mounting

Surface Mount

Part Package Code

SOIC

Eccn Us

EAR99

Risk Rank

5.49

Typical Operating Supply Voltage V

-5|5|-3.3|3.3

Yüzey Montaj

YES

Reflow Temperaturemax S

30

Maximum High Level Output Current Ma

-50

Uzunluk

3 mm

Maximum Low Level Output Current Ma

50