MCIMX6S5DVM10AD

Specifications

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Terminal Formu

BALL

Kılıf / Paket

624-LFBGA

Supply Voltagemax Vsup

1.5V

Upsucsperipheral Ics Type

SoC

Package Shape

SQUARE

Package Equivalence Code

BGA624,25X25,32

Maks. Oturma Yüksekliği

1.6mm

Ram Words

144K

Package Code

LFBGA

Tepe Reflow Sıcaklığı (°C)

260

Fabrika Tedarik Süresi

15 Weeks

Parça Durumu

Active

Voltage Io

1.8V 2.5V 2.8V 3.3V

Jesd30 Code

S-PBGA-B624

Ihs Manufacturer

NXP SEMICONDUCTORS

HTS Kodu

8542.39.00.01

Ram Controllers

LPDDR2, LVDDR3, DDR3

Genişlik

21 mm

Ethernet

10/100/1000Mbps (1)

Supply Voltagemin

1.35 V

JESD-609 Kodu

e1

Package Description

MABGA-624

Yayın Yılı

2017

Ambalaj

Tray

Part Life Cycle Code

Active

Core Processor

ARM® Cortex®-A9

Moisture Sensitivity Levels

3

Terminal Sayısı

624

Terminal Kaplaması

Tin/Silver/Copper (Sn/Ag/Cu)

Supply Voltagemax

1.5 V

Seated Heightmax

1.6 mm

Yüzey Montaj

YES

Usb

USB 2.0 + PHY (4)

Additional Interfaces

CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART

Security Features

ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection

Seri

i.MX6S

Tepe Reflow Süresi (maks. sn)

40

Bus Compatibility

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB