MCIMX6Q5EYM10AD

Specifications

Yayın Yılı

2002

Ambalaj

Tray

Ram Controllers

LPDDR2, LVDDR3, DDR3

HTS Kodu

8542.31.00.01

Genişlik

21 mm

Ethernet

10/100/1000Mbps (1)

Supply Voltagemin

1.35 V

JESD-609 Kodu

e1

Package Description

FCBGA-624

Core Processor

ARM® Cortex®-A9

Moisture Sensitivity Levels

3

Supply Voltagemax

1.5 V

Terminal Kaplaması

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Sayısı

624

Additional Feature

24MHZ NOMINAL FREQ AVAILABLE

Part Life Cycle Code

Active

Bit Size

64

Package Shape

SQUARE

Maks. Oturma Yüksekliği

1.6mm

REACH Uyumluluk Kodu

compliant

Terminal Formu

BALL

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltagemax Vsup

1.5V

Kılıf / Paket

624-LFBGA, FCBGA

Upsucsperipheral Ics Type

MICROPROCESSOR

Voltage Io

1.8V 2.5V 2.8V 3.3V

Operating Temperaturemin

-20 °C

Jesd30 Code

S-PBGA-B624

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Code

LFBGA

Tepe Reflow Sıcaklığı (°C)

260

Fabrika Tedarik Süresi

15 Weeks

Parça Durumu

Active

Address Bus Width

16

Çalışma Sıcaklığı

-20°C~105°C TJ

Usage Level

Commercial grade

External Data Bus Width

64

Package Body Material

PLASTIC/EPOXY

Speed

1.0GHz

Format

FIXED POINT