MCIMX6D5EYM10AD

Specifications

Jesd30 Code

S-PBGA-B624

Ihs Manufacturer

NXP SEMICONDUCTORS

Voltage Io

1.8V 2.5V 2.8V 3.3V

Operating Temperaturemin

-20 °C

Fabrika Tedarik Süresi

15 Weeks

Parça Durumu

Active

Package Code

LFBGA

Tepe Reflow Sıcaklığı (°C)

260

Package Shape

SQUARE

Maks. Oturma Yüksekliği

1.6mm

Kılıf / Paket

624-LFBGA, FCBGA

Supply Voltagemax Vsup

1.5V

Upsucsperipheral Ics Type

MICROPROCESSOR

REACH Uyumluluk Kodu

compliant

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Terminal Formu

BALL

Additional Feature

24MHZ NOMINAL FREQ AVAILABLE

Core Processor

ARM® Cortex®-A9

Moisture Sensitivity Levels

3

Terminal Sayısı

624

Terminal Kaplaması

Tin/Silver/Copper (Sn/Ag/Cu)

Supply Voltagemax

1.5 V

Part Life Cycle Code

Active

Bit Size

64

Yayın Yılı

2002

Ambalaj

Tray

Supply Voltagemin

1.35 V

Ethernet

10/100/1000Mbps (1)

JESD-609 Kodu

e1

Package Description

FCBGA-624

HTS Kodu

8542.31.00.01

Ram Controllers

LPDDR2, LVDDR3, DDR3

Genişlik

21 mm

Boundary Scan

YES

Sata

SATA 3Gbps (1)

Uzunluk

21mm

Nem Hassasiyeti (MSL)

3 (168 Hours)

Coprocessorsdsp

Multimedia; NEON™ SIMD

Graphics Acceleration

Yes

Number Of Terminals

624