Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Propagation Delay Tpd
- 6.5 ns
- HTS Kodu
- 8542.39.00.01
- Tepe Reflow Sıcaklığı (°C)
- 260
- Terminal Formu
- GULL WING
- Part Life Cycle Code
- Transferred
- Moisture Sensitivity Levels
- 1
- Seated Heightmax
- 2 mm
- Package Code
- SSOP
- JESD-609 Kodu
- e4
- Jesd30 Code
- R-PDSO-G14
- Qualification Status
- Not Qualified
- Package Style
- SMALL OUTLINE, SHRINK PITCH
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- Risk Rank
- 5.11
- REACH Uyumluluk Kodu
- unknown
- Package Shape
- RECTANGULAR
- Fonksiyon Sayısı
- 4
- Supply Voltagemin Vsup
- 1.2 V
- Package Body Material
- PLASTIC/EPOXY
- Supply Voltagemax Vsup
- 3.6 V
- Terminal Kaplaması
- NICKEL PALLADIUM GOLD
- Source Url Status Check Date
- 2013-06-14 00:00:00
- Üretici Parça No
- 74LVC00ADB-T
- Technology
- CMOS
- Operating Temperaturemin
- -40 °C
- Yüzey Montaj
- YES
- Load Capacitance Cl
- 50 pF
- Number Of Terminals
- 14
- Logic Ic Type
- NAND GATE
- Temperature Grade
- AUTOMOTIVE
- Family
- LVC/LCX/Z
- Genişlik
- 5.3 mm
- Terminal Adımı
- 0.65 mm
- Number Of Inputs
- 2
- Supply Voltagenom Vsup
- 2.7 V
- Reflow Temperaturemax S
- 30
- Terminal Pozisyonu
- DUAL
- Uzunluk
- 6.2 mm
- Rohs Code
- Yes
- Operating Temperaturemax
- 125 °C
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