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Priced by quantity and lead time.
Shipping
Same-day dispatch from stock
Genuine parts
Verified sourcing
RoHS
Compliant
Support
Technical team support
Specifications
- Speed
- 350 MHz
- Package Body Material
- PLASTIC/EPOXY
- Package Description
- BGA,
- Package Style
- GRID ARRAY
- Supply Voltagenom
- 2 V
- REACH Uyumluluk Kodu
- unknown
- Terminal Formu
- BALL
- Part Life Cycle Code
- Active
- Supply Voltagemax
- 2.1 V
- Package Code
- BGA
- Upsucsperipheral Ics Type
- MICROPROCESSOR, RISC
- Integrated Cache
- NO
- HTS Kodu
- 8542.31.00.01
- Yüzey Montaj
- YES
- Ihs Manufacturer
- NXP SEMICONDUCTORS
- Package Shape
- RECTANGULAR
- Boundary Scan
- YES
- Number Of Terminals
- 255
- Terminal Pozisyonu
- BOTTOM
- Low Power Mode
- NO
- Jesd30 Code
- R-PBGA-B255
- Format
- FIXED POINT
- Supply Voltagemin
- 1.9 V